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Feature Summary
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General
- Low power X86 based single board computer (SBC)
- Intended for rugged industrial applications, ready-for-use (Embedded Gold)
- Industrial PCB assembly
- PCB Dimensions 133.0mm x 138.0mm (h x w)
- Intel® Apollo Lake-I (APL-I) SoC E39xx processor series (scalable GC600/GC610 versions)
- Versatile standard I/O connector suite (dual DisplayPort, dual USB 3.0, dual M12-X GbE)
- Choice of two versions - without (GC600) or with (GC610) wireless networking WLAN - WWAN - BT
- SMA/SMA-RP antenna connectors (GC610)
- M12 power connector
- Option terminal block power connector
- Wide range DC power input operation 9-57V
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I/O Connectors
- Dual M12-X Gigabit Ethernet circular connectors (railway and industrial standard)
- 1000BASE-T, 100BASE-TX, 10BASE-T compliant data transfer rate
- Dual USB 3.0 Type-A receptacles
- Dual DisplayPort connectors
- M12-A DC power connector
- Option terminal block 3.5mm pitch 4-position screw lock power input
Additional I/O GC610
- GC610 is the wireless version of GC600
- Assembly of the GC600 base board and a GC010 4HP mezzanine module
- SMA/SMA-RP on-board antenna connectors for WWAN, Wi-Fi 6, Bluetooth 5, GNSS
- Module RF to PCB by MHF4 to MHF4 coaxial patch cables
- Optional SMA antenna connectors by MHF4 to SMA/SMA-RP pigtail cables
- Dual Micro-SIM card slot for WWAN modem up to 5G
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Processor
- Intel® Apollo Lake (APL-I) SoC E39xx Series
- x7-E3950 • 4 Cores • 1.6GHz (TB 2.0GHz) • 12W TDP/cTDP • 400/650MHz graphics • 2MB LLC
- x5-E3940 • 4 Cores • 1.6GHz (TB 1.8GHz) • 9W TDP/cTDP • 400/600MHz graphics • 2MB LLC
- x5-E3930 • 2 Cores • 1.3GHz (TB 1.8GHz) • 6W TDP/cTDP • 400/550MHz graphics • 2MB LLC
- Graphics Burst, CPU Burst, Intel® Speedstep®
- Intel® Virtualization Technology (Intel® VT-x / VT-d)
- Intel® Trusted Execution Engine (Intel® TXE) 3.0
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Firmware
- Phoenix® UEFI (Unified Extensible Firmware Interface) with CSM*
- Fully customizable by EKF
- Secure Boot and Measured Boot supported - meeting all demands as specified by Microsoft®
- Windows®, Linux and other (RT)OS' supported
* CSM (Compatibility Support Module) emulates a legacy BIOS environment,
which allows to boot a legacy operating system such as DOS, 32-bit Windows and some RTOS'
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Main Memory
- Integrated memory controller up to 8GB DDR3L 1600 +ECC
- Soldered memory for rugged applications
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Mass Storage
- On-board M.2 SSD socket (autosensing PCIe® or SATA based, up to 2280 size)
- Up to 2TB capacity as of current - refer to GC600/610 SKUs
- Option Micro SD Card socket (SDHC, SDXC), available on request
- SPI Flash 128Mbit (UEFI firmware and customer application data)
- Option e•MMC (embedded MMC 5.0 up to 64GByte soldered)
- Option mezzanine storage expansion via HSE connector (up to 2 x PCIe®, 1 x USB 3.0)
- Option custom specific mezzanine board design on request
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Graphics
- Integrated HD Graphics Engine, Gen 9 LP
- DirectX 12.0, OpenCL 2.0 Full Profile, OpenGL 4.3
- HW video decode H264 L5.2, H.265 HEVC, VP9, MVC, MPEG2, JPEG/MJPEG, VC1, WMV9, VP8
- HW video encode H264, SVC, AVC, MVC, MPEG-2
- Content protection PAVP, HDCP 1.4
- 2 x DisplayPort connectors
- DisplayPort™ 1.2a
- Max Resolution 4096 x 2160 @60Hz
- Audio streams encoded
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Networking
- Dual networking interface controllers (NIC), 1000BASE-T, 100BASE-TX, 10BASE-T connections
- Intel® I210-IT -40°C to +85°C operating temperature GbE controllers w. integrated PHY
- IPv4/IPv6 checksum offload, 9.5KB Jumbo Frame support, EEE Energy Efficient Ethernet
- IEEE 802.1Qav Audio-Video-Bridging (AVB) enhancements for time-sensivitive streams
- IEEE 1588 and 802.1AS packets hardware-based time stamping for high-precision time synchronization
- Two M12-X circular connectors
- Option 1 x Intel® I210-IS (SerDes GbE for Ethernet switch port expansion (mezzanine module)
Wireless Networking GC610
- Option Wi-Fi with M.2 mezzanine module (Wi-Fi-6 802.11AX, BT 5.0)
- Option WWAN with M.2 mezzanine module (3G/4G/5G & GNSS)
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APL SoC I/O Usage
- 2 x PCIe® and 1 x SATA to M.2 SSD connector (auto switching logic PCIeŽ/SATA)
- 2 x PCIe® to 2 x I210-IT networking controllers
- 2 x PCIe® to P-HSE high speed expansion port connector (only 1 x PCIe® if 3rd NIC I210-IS is populated)
- 1 x USB 3.0 to P-HSE high speed expansion port connector
- 2 x USB 3.0 to Type-A connectors
- 2 x DisplayPort to DP connectors
- 1 x HS400 (e.MMC) to embedded MMC 5.0 64GByte (ordering option, mass storage device)
- SDIO (Micro SD Card) slot (option)
- LPC to TPM 2.0 module (option)
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Building Blocks
- 2 x Gigabit Ethernet controllers Intel® I210IT (front panel)
- Option 1 x Intel® I210-IS (for SerDes networking expansion port connector)
- M.2 socket for 2280 SSD
- Option e•MMC (embedded MMC 5.0 64GByte HS400)
- Option Trusted Platform Module TPM 2.0
GC610 Additions
- M.2 socket for 2230 Wi-Fi module
- M.2 socket for 3042 WWAN module (up to 3052 & 3060 extended 5G module)
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Security
- Trusted Platform Module (option)
- TPM 2.0 for highest level of certified platform protection
- Infineon Optiga™ SLB 9665 cryptographic processor
- Conforming to TCG 2.0 specification
- AES hardware acceleration support (Intel® AES-NI)
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Local Expansion
- Mezzanine card connectors HSE and SERDES for optional local expansion
- HSE: 2 x PCIe®, 1 x USB 3.0, 2 x USB 2.0
- Choice of HSE based mezzanine I/O or storage modules
- GC010 HSE based wireless module for Wi-Fi, Bluetooth, WWAN, GNSS connectivity (GC610)
- Custom specific HSE based mezzanine module design
- Option SERDES connector - Gigabit Ethernet SerDes I/F derived from I210-IS NIC
- Custom specific SERDES based mezzanine switching module design
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Power Requirements
- DC Input, 9V-57V (e.g. 12VDC, 24VDC, 48VDC nominal input voltage)
- Power consumption 25W max.
- Fast acting chip fuse (PCB soldered type - no replacement on-site)
- Protected against reverse polarity
- ESD protection (TVS)
- Common mode input filter
- M12-A 5-pin power connector
- Option terminal block 3.5mm pitch 4-position screw lock power input
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Applications
- Ultra compact industrial PC
- X86 code compatibility for rapid time to market
- Machine control
- Kiosk systems, information panels
- Dual 4k display solution, independent operation
- Single display or headless applications
- Industrial networks - IIoT
- Cable and wireless networking
- Router, bridges
- Rugged environments
- Edge computing
- Vehicles, transportation
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Environmental, Regulatory
- Designed & manufactured in Germany
- Certified quality management according to ISO 9001
- Long term availability
- Rugged solution
- Conformal coating, sealing, underfilling on request
- RoHS compliant
- Operating temperature -40°C to +85°C (industrial temperature range) available
- Storage temperature -40°C to +85°C, max. gradient 5°C/min
- Humidity 5% ... 95% RH non condensing
- Altitude -300m ... +3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
- EC Regulatory EN55024, EN55032, EN62368-1 (CE)
- MTBF tbd years (GC600)
- MTBF tbd years (GC610)
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all items are subject to changes
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