The S83-P6 is equipped with an M.2 PCIe^® Gen4 x4 socket, suitable for an NVMe type SSD module. The maximum PCIe^® data transfer rate depends on the particular CPU carrier card (16GT/s require SC9-TOCCATA).

Four discrete Gigabit Ethernet controllers are provided on-board, for CompactPCI^® Serial backplane communication via the P6 connector according to the 2.5GBASE-T interface standard.

The Intel^® I226-IT 2.5GbE controllers support latest networking features and are backward compatible to 1000BASE-T as originally specified by the CompactPCI^® Serial specification. With a suitable Ethernet enabled CompactPCI^® Serial backplane, both networking architectures are supported, either single star or full mesh.

The S83-P6 connects to the mezzanine expansion connectors HSE1 and HSE2 of the CompactPCI^® Serial CPU carrier board, maintaining the 4HP (20.32mm) total assembly height.

• Proprietary size mezzanine module - low profile
• Fits basically into the 4HP (20.32mm) envelope of the CPU carrier board
• Typically delivered as a ready to use assembly unit (including CPU card)
• Mounting position right (on top of a CPU board)

• SC4-CONCERTO
• SC5-FESTIVAL
• SC8-FLUTE
• SC9-TOCCATA

• Single M.2 socket, maximum M.2 SSD size 2280 (M.2 formerly known as NGFF)
• Suitable for M.2 NVMe SSD module, key Id M, PCIe^® x4 I/F
• Autosense option for SATA SSD (depends on carrier card)
• PCIe^® x4 up to Gen4 sourced via HSE1 mezzanine connector
• Maximum (theoretical) 64Gbps I/O data transfer rate (Gen4 PCIe 16GT/s)
• Module dimensions 2230/2242/2260/2280, screw fixed (2280 w. locking bar)
• M.2 Module height (Label) S3 - top side component height 1.5mm max., no bottom side components
• Module 3.3V power DC/DC regulator can be switched off/on via I2C (BIOS settings)

• USB 3.2 Gen1/2 (5G/10G) depending on CPU carrier card in use
• DP Alt Mode (DisplayPort 1.2/1.4a MST depending on CPU carrier card)
• V_BUS power DC/DC regulator can be switched off/on via I2C (BIOS settings)

• 4 x 2.5GBASE-T, individual I226-IT NICs
• Backward compatible to 1000BASE-T CompactPCI^® Serial cards
• For use with Ethernet enabled backplanes (equipped w. J6 connector)
• Suitable for Star and Mesh Ethernet configured backplanes
• Suitable for a rear I/O Ethernet module

• High speed mezzanine connectors
• Suitable for PCI Express^® Gen3/4, USB 5G/10G, DisplayPort
• Bottom mount male connectors HSE1 and HSE2 (high speed expansion)
• Mating with the corresponding carrier card female connectors HSE1/2
• Board-to-board height 10.8mm for a 4HP assembly

  HSE1

• PCI Express^® 1x4 support (dedicated to the NVMe SSD module M.2 socket)
• PCIe^® Gen4 supported (depends on carrier card)
• USB3 up to 10Gbps support (dedicated to the optional Type-C USB front panel connector)
• SATA supported (assigned to the M.2 SSD socket, depends on carrier card)
• Power sourcing 12V/1.5 A maximum continuous current (2 pins)

  HSE2

• PCI Express^® 4x1 support (dedicated to the PCIe^® based on-board Gigabit Ethernet controllers)
• DisplayPort (for Type-C DP Alt Mode, depends on CPU carrier board)
• Power sourcing 12V/3.0 A maximum continuous current (4 pins)

• Four individual Intel^® I225/226-IT networking interface controllers (NIC)
• 2.5GBASE-T, 1000BASE-T, 100BASE-TX, 10BASE-T 802.3 specifications
• -40°C to +85°C operating temperature 10M/100M/1G
• -40°C to +70°C operating temperature 2.5G (I225)
• -40°C to +85°C operating temperature 2.5G (I226)
• UDP, TCP and IP checksum offload
• 9KB Jumbo Frame support
• Four transmit and four receive queues
• IEEE 802.3az Energy Efficient Ethernet
• Ultra-low power at cable disconnect (5mW)
• Time Sensitive Networking (TSN)
• IEEE 1588 - Basic time-sync (Precision Time Protocol)
• IEEE 802.1AS-Rev - Higher precision time synchronization with multiple (dual) clock masters
• IEEE 802.1Qav - Credit Based Shaping and Basic scheduling
• IEEE 802.1Qbu - Frame Preemption
• IEEE 802.1Qbv - Time Aware Shaper
• IEEE 802.3br - Interspersing Express Traffic
• PCIe^® PTM for synchronization between the NIC and Host timers
• Based on four PCI Expess^® x1 links derived from the mezzanine connector HSE2
• Driver support for all major operating systems

• Low profile mezzanine module for EKF CPU Cards (SC5-FESTIVAL and later)
• 4HP assembly CPU carrier board and S83-P6 mezzanine card
• Adds SSD mass storage and backplane Ethernet networking to the CPU carrier
• M.2 based mass storage, 1 x M.2 PCIe x4 socket (NVMe)
• On-board 2.5GbE NICs for backplane communication and multiprocessing via backplane connector P6, four GbE ports (suitable for single star architecture or full mesh or RIO)
• Additional monitor via Type-C DP Alt Mode

• Designed & manufactured in Germany
• ISO 9001 certified quality management
• Long term availability
• Rugged solution
• Coating, sealing, underfilling on request
• Lifetime application support
• RoHS compliant
• Operating temperature -40°C to +85°C industrial temperature range
• Storage temperature -40°C to +85°C, max. gradient 5°C/min
• Humidity 5% ... 95% RH non condensing
• Altitude -300m ... +3000m
• Shock 15g 0.33ms, 6g 6ms
• Vibration 1g 5-2000Hz
• EC Regulatory EN55035, EN55032, EN62368-1
• MTBF tbd years